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Copper--Fundamental Mechanisms for Microelectronic Applications
The topic of copper metallization for future integrated circuits is an area of intense research and development. This text presents the fundamentals and appl... »
The topic of copper metallization for future integrated circuits is an area of intense research and development. This text presents the fundamentals and appl... »
Chemical Mechanical Planarization Of Microelectronic Materials
This text explains how to use the chemical mechanical planarization (CMP) process to improve the electronic properties of such substances as oxide, tungsten,... »
This text explains how to use the chemical mechanical planarization (CMP) process to improve the electronic properties of such substances as oxide, tungsten,... »
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