John H. Lau

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Handbook Of Tape Automated Bonding
Handbook Of Tape Automated Bonding
 »
 
 
 
 
 

Reliability Of Rohs-Compliant 2d And 3d Ic Interconnects
Reliability Of Rohs-Compliant 2d And 3d Ic Interconnects
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Reliability of Rohs-Compliant 2D and 3D Ic Interconnects
Reliability of Rohs-Compliant 2D and 3D Ic Interconnects
 »
 
 
 
 
 

Advanced Mems Packaging
Advanced Mems Packaging
A comprehensive guide to advanced microelectromechanical systems (MEMS) »
 
 
 
 
 

Solder Joint Reliability
Solder Joint Reliability
Theory And Applications »
 
 
 
 
 

Electronics Manufacturing
Electronics Manufacturing
With Lead-free, Halogen Free, and Conductive Adhesive Materials »
 
 
 
 
 

Mechanics of Solder Alloy Interconnects
Mechanics of Solder Alloy Interconnects
As the trend toward the increased miniaturization of devices continues, solder interconnects are becoming the limiting factor in the reliability of electroni... »
 
 
 
 
 

Chip on Board Technology for Multichip Modules
Chip on Board Technology for Multichip Modules
Technology for Multichip Modules »
 
 
 
 
 

Microvias
Microvias
Low Cost, High Density Interconnects »